Micro powder for diamond wire saw
Product features:
The raw material is MBD series diamond with high strength, high thermal stability, low magnetism and low ash content;
After special crushing, shaping, grading and surface clean processing technology, particle morphology is rough surface of multi-angle block, particle size distribution is very concentrated, effective cutting particles account for a high proportion, put an end to large particles, low surface impurity content.
Recommended use:
Suitable for cutting, grinding and polishing of brittle materials with high hardness. Such as: silicon materials, gemstones, glass, magnetic materials, semiconductors and other hard brittle new materials.
+86-0510 85225399
+86-0510 85225366
+86-0510 85225399